Yancheng Hongshi Intelligent Technology Co., Ltd. was founded in 2017, focusing on next-generation MicroLED light chip core technology R&D, with fully independent IP and core patents. R&D centers are located in Shanghai, Suzhou, and Shenzhen, with headquarters and manufacturing in Yancheng. Over 40% of employees are R&D personnel with multiple core invention patents.
Since 2020, Hongshi has been conducting microdisplay light chip R&D. It possesses core technologies such as 8-inch silicon-based HB² hybrid bonding, quantum dot conversion, HSS™ single-piece full color / three-piece full color, and metasurface, and has full industrial chain capabilities from optical design to module design and production.
We emphasize user experience and sustainability, aiming to provide more convenient and comfortable experiences, and continuously optimize product features and interface design. Hongshi adheres to customer-centric, product-oriented, technology-focused philosophy, advancing the optoelectronics industry through rapid iteration.
Looking ahead, we will continue breaking through technical bottlenecks with innovative spirit, bring more surprises to users, invest further resources, and strengthen partner cooperation to jointly develop the market and achieve win-win outcomes.