Hongshi
MicroLED

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MicroLED Technology

HB² = Hongshi Base x Hybrid Bonding

  • Hongshi Base Hybrid Bonding Technology
  • Metasurface Digital Light Field Control Technology
  • Quantum Dot Color Conversion Technology
Appliance

A Wider Array of Application Scenarios

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About Us

Yancheng Hongshi Intelligent Technology Co., Ltd. was founded in 2017, focusing on independent R&D of next-generation microdisplay chips (MicroLED), fully mastering proprietary intellectual property and core patents. Hongshi has deeply cultivated the microdisplay chip field, with R&D centers in Shanghai, Suzhou, and Shenzhen, and headquarters and manufacturing center in Yancheng. Over 40% of the company’s employees are engaged in R&D, holding multiple core invention patents.

Since 2020, the company has been conducting R&D on microdisplay chips (MicroLED). Hongshi possesses core technologies and patents including 8-inch silicon-based, HB² hybrid bonding, quantum dot conversion, HSS™ full color, and metasurface, with full industrial chain capability from optical device design to module design and production.

In addition to technological innovation, we also focus on user experience and sustainability. We are committed to providing users with more convenient and comfortable experiences, continuously optimizing product functionality and interface design. Hongshi always adheres to a customer-centric, product-oriented, and technology-driven philosophy, promoting the development of the optoelectronic industry through rapid iteration.

Looking forward, we will continue to break through technical bottlenecks with an innovative spirit and bring more surprises to our users. We will keep investing resources and strengthen cooperation with partners to jointly explore the market and achieve win-win outcomes.